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ZBD.D90.L02+304 is a high-precision glass sintered wall feedthrough connector for semiconductor bonding machines, with 2 power cores and 4 low-voltage cores. Adopting glass sintering hermetic sealing and kovar alloy contacts, it realizes reliable power and signal transmission through walls. With ultra-high temperature resistance and IP68 hermetic performance, it is specially designed for harsh working conditions of semiconductor manufacturing equipment, complying with RoHS standards.
This Glass Sintered Feedthrough Connector features advanced glass sintering technology, achieving IP68 hermetic seal (10⁻⁵pa air tightness) and 750V withstand voltage, effectively isolating internal and external environments and preventing gas leakage in semiconductor clean rooms.
It withstands -55°C~400°C long-term working temperature and 550°C for 1 hour, adapting to high-temperature processes of Semiconductor Bonding Machine. With ≤95% humidity resistance and 96hr salt spray corrosion resistance, it is suitable for various harsh industrial environments.
Equipped with Kovar Alloy Contact and stainless steel housing, matched with ceramic insulation (TAD/TKB) and glass sintering (ZBD), the contact resistance is ≤25mΩ. The materials ensure high structural strength and excellent electrical insulation performance for long-term stable use.
It resists 100g shock (6ms) and 15g vibration (10Hz~2000Hz), meeting the high stability requirements of semiconductor equipment. The mechanical life reaches 5000 plugging cycles, satisfying the high-frequency use demands of industrial production lines.
With 2×3.5mm power cores (20A) and 4×1.5mm low-voltage cores (1A), it supports separate power and signal transmission. The wire is fixed by crimping terminals and locking screws, ensuring firm connection and no loosening during equipment operation.
Providing TAD/TKB plug and ZBD socket models, with multiple key position angles (60°/80°/90° etc.) optional, it can be perfectly matched with different semiconductor bonding machine models, realizing precise and anti-misplug connection.
It is the core feedthrough connector for semiconductor wafer bonding machines, realizing wall-through transmission of power and control signals in the bonding process. The hermetic sealing performance meets the air tightness requirements of the bonding machine's working chamber, ensuring high-precision processing.
Applicable to various wafer processing equipment such as etching and deposition machines. The high temperature and corrosion resistance adapt to the high-temperature and corrosive gas environment of wafer processing, and the anti-shock performance ensures stable signal transmission during equipment operation.
Suitable for all kinds of wall-through connection of precision equipment in semiconductor clean rooms. The glass sintering hermetic seal effectively prevents the exchange of air inside and outside the clean room, maintaining the cleanliness level of the production environment and meeting the strict requirements of semiconductor manufacturing.
Applied to other high-precision industrial equipment with high-temperature, hermetic and anti-vibration requirements such as laser processing and aerospace component manufacturing. The multi-core separate transmission design meets the diversified power and signal transmission needs of equipment.
A: It adopts glass sintering hermetic sealing, high temperature resistance and low contact resistance, meeting the air tightness, high temperature and high precision signal transmission requirements of semiconductor bonding machine's working process.
A: It has 96hr salt spray corrosion resistance, with stainless steel housing and kovar alloy contacts, which can resist mild corrosive gas in semiconductor production, and additional protection is recommended in strong corrosion environments.
A: The standard is 2+4 core configuration, and we support customized pin configuration, current and key position angles according to the actual needs of semiconductor equipment customers for bulk orders.
ZBD.D90.L02+304 is a high-precision glass sintered wall feedthrough connector for semiconductor bonding machines, with 2 power cores and 4 low-voltage cores. Adopting glass sintering hermetic sealing and kovar alloy contacts, it realizes reliable power and signal transmission through walls. With ultra-high temperature resistance and IP68 hermetic performance, it is specially designed for harsh working conditions of semiconductor manufacturing equipment, complying with RoHS standards.
This Glass Sintered Feedthrough Connector features advanced glass sintering technology, achieving IP68 hermetic seal (10⁻⁵pa air tightness) and 750V withstand voltage, effectively isolating internal and external environments and preventing gas leakage in semiconductor clean rooms.
It withstands -55°C~400°C long-term working temperature and 550°C for 1 hour, adapting to high-temperature processes of Semiconductor Bonding Machine. With ≤95% humidity resistance and 96hr salt spray corrosion resistance, it is suitable for various harsh industrial environments.
Equipped with Kovar Alloy Contact and stainless steel housing, matched with ceramic insulation (TAD/TKB) and glass sintering (ZBD), the contact resistance is ≤25mΩ. The materials ensure high structural strength and excellent electrical insulation performance for long-term stable use.
It resists 100g shock (6ms) and 15g vibration (10Hz~2000Hz), meeting the high stability requirements of semiconductor equipment. The mechanical life reaches 5000 plugging cycles, satisfying the high-frequency use demands of industrial production lines.
With 2×3.5mm power cores (20A) and 4×1.5mm low-voltage cores (1A), it supports separate power and signal transmission. The wire is fixed by crimping terminals and locking screws, ensuring firm connection and no loosening during equipment operation.
Providing TAD/TKB plug and ZBD socket models, with multiple key position angles (60°/80°/90° etc.) optional, it can be perfectly matched with different semiconductor bonding machine models, realizing precise and anti-misplug connection.
It is the core feedthrough connector for semiconductor wafer bonding machines, realizing wall-through transmission of power and control signals in the bonding process. The hermetic sealing performance meets the air tightness requirements of the bonding machine's working chamber, ensuring high-precision processing.
Applicable to various wafer processing equipment such as etching and deposition machines. The high temperature and corrosion resistance adapt to the high-temperature and corrosive gas environment of wafer processing, and the anti-shock performance ensures stable signal transmission during equipment operation.
Suitable for all kinds of wall-through connection of precision equipment in semiconductor clean rooms. The glass sintering hermetic seal effectively prevents the exchange of air inside and outside the clean room, maintaining the cleanliness level of the production environment and meeting the strict requirements of semiconductor manufacturing.
Applied to other high-precision industrial equipment with high-temperature, hermetic and anti-vibration requirements such as laser processing and aerospace component manufacturing. The multi-core separate transmission design meets the diversified power and signal transmission needs of equipment.
A: It adopts glass sintering hermetic sealing, high temperature resistance and low contact resistance, meeting the air tightness, high temperature and high precision signal transmission requirements of semiconductor bonding machine's working process.
A: It has 96hr salt spray corrosion resistance, with stainless steel housing and kovar alloy contacts, which can resist mild corrosive gas in semiconductor production, and additional protection is recommended in strong corrosion environments.
A: The standard is 2+4 core configuration, and we support customized pin configuration, current and key position angles according to the actual needs of semiconductor equipment customers for bulk orders.
